LED Package Process - 04 Oven Backing
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작성자 관리자 작성일16-06-28 16:15 조회245회 댓글0건본문
<LED 제조과정순서>
LED Package Process
01 Die bonding process
02 Wrie Bonding process
03 Dispensing process
04 Oven Backing <- 진행단계
05 Electrical Test
06 Tapping
LED S.M.T Process
01 Screen Printer
02 Chip mounter
03 Reflow
